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W H I T E P A P E R :
On-Demand Bonding By Jonathan M. Gorbold, Vice-President, CODACO Inc. WHAT IF you could pre-apply bonding material to your components, and then instantly activate the bond later, whenever you're ready? |
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| INTRODUCTION |
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"The most important advantage |
The new CODACO High Speed RF Bonding System provides a technically robust, environmentally-responsible solution to a problem facing manufacturers whose products incorporate paper or paperboard substrates. The existing methods used to bond or seal these materials are generally either water or solvent-based glues which require extensive set-up and dry time, or hot melts which have a limited amount of "open time" to complete the assembly process before the adhesive cools and sets. |
 Click here to download the entire Tech Note from our on-line database! |
The manufacturing challenge has therefore been to physically separate the process of applying adhesive to these substrates from the actual process of bonding them together. With the CODACO System, manufacturers can pre-apply a tack-free adhesive to paper or paperboard substrates, freely manipulate the substrates in complex assembly processes, and later rapidly activate the adhesive from within the bond line with RF energy. Similarly, one layer of a paper or paperboard web can be pre-applied with CODACO adhesive material for later, on-demand adhesive bonding to other substrate layers.
All of this is accomplished with environmentally friendly, water-dispersable material and clean, efficient radio frequency (RF) energy. Manufacturers will benefit from increased productivity and greater design latitude in their products, while consumers will benefit from improved product features delivered by technologically empowered manufacturers. MORE |
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Copyright © 2006 CODACO • 465 Paul Road, Unit 6 • Rochester NY 14624 USA
Tel: 1-585-429-1600, X-206 • Fax: 1-585-429-1603 • info@codaco.com |
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