W H I T E   P A P E R :

On-Demand Bonding & Sealing
Of Polyethylene & Polypropylene Components

By Jonathan M. Gorbold, Vice-President, CODACO Inc.

WHAT IF:
you could pre-apply bonding material to your components, and then instantly activate the bond later, whenever you're ready?

INTRODUCTION

"The most important advantage
of the CODACO System is its
bond-on-demand capability,
which separates the application
of the bonding material from the actual bonding process."

The new CODACO High Speed RF Bonding System provides a technically robust, environmentally-responsible solution to a problem facing manufacturers whose products incorporate polyethylene or polypropylene substrates. The existing methods used to bond or seal these materials are generally either hot melt or cross linking glues which are difficult to apply or require extensive set-up and dry time; additional internal aluminum layers or external metal bars may also be required to transfer heat to create the PE to PE or PP to PP seal.

The manufacturing challenge has therefore been to physically separate the process of applying the bonding material to these substrates from the actual process of bonding them together. With the CODACO System, manufacturers can pre-apply a tack-free bonding material to polyethylene and polypropylene substrates, freely manipulate the substrates in complex assembly processes, and later rapidly activate the adhesive from within the bond line with RF energy. Similarly, one layer of a high-speed polyethylene or polypropylene web can be pre-applied with CODACO adhesive material for later, on-demand fusion bonding to other substrate layers.

All of this is accomplished with environmentally friendly, water-dispersable material and clean, efficient radio frequency (RF) energy. Manufacturers will benefit from increased productivity and greater design latitude in their products, while consumers will benefit from improved product features delivered by technologically empowered manufacturers. MORE