Bonding Systems Product Catalog

Key System Benefits TELL ME MORE

Improved Manufacturing Flexibility
• Off-Line Adhesive Application: apply now, activate later!
• Focused, Selective Activation: permits phased assembly
Advanced Production Control
• Heats From Within Bond Line
• RF Field Generated From Only One Side
• Controllable Bond Line Temperatures
• Controllable Open Time
Increased Productivity
• Bonds at speeds up to 1500 ft/min.

•	Can be formulated from different polymers to suit the customer's individual application: water-based for paperboard applications, thermoplastic for polyolefin bonding, or thermoset
•	A non-metallic polymeric material, activated by RF energy
•	Can be applied on-line, or pre-applied off-line for later activation on-demand
•	Can be tack-free after application, to permit re-rolling and re-packaging of substrate
•	Light colored or clear, contains no particulate additives
•	Applicable to virtually any non-metallic material
•	Can be formulated for application as a hot melt, aqueous spray, pattern print or co-extrusion
•	For reversible adhesive or permanent fusion bonding, depending on process parameters
•	Very fast activation times (< 200 milliseconds) with controllable open time

	STEP & REPEAT ACTIVATION SYSTEM
•	Designed for one-up, single use
•	An excellent tool for investigating the capabilities of the CODACO system
•	Includes 1 kW frequency-agile 60 MHz power source & RF probe mounted in a sturdy EMC enclosure
•	Delivers RF field to activate adhesive material
•	Probe is recessed into a pressure plate to precisely locate the substrate and bond line in RF field.
	DYNAMIC ACTIVATION SYSTEM
•	Designed for production bonding at up to 1500 ft./min.
•	< 200 millisecond dwell time
•	Pre-applied adhesive is activated as web passes over the probe, which is mounted in a teflon plate. The heat generated within the bond line produces either an adhesive or a fusion bond in the web layer.
•	After activation, pressure is usually applied by passing the web through a nip.

	RF Power Supply MORE ABOUT INDUCTION HEATING
•	Pinpoint accuracy with microprocessor control and continuous digital tuning
•	100% solid state RF power and control circuitry
•	Up to 2 kW deliverable power, frequency agile over 10-15 MHz, 27.12 MHz +/- 130 kHz, or 57 to 62 MHz
•	CE marked for all applicable safety and EMC emission standards

Key System Benefits

Increased Manufacturing Flexibility

Off-Line Adhesive Application: Hot melt formulations can be pre-applied, allowed to cool and set, and at a later time reactivated in the RF field. This allows the adhesive applicators to be removed from the assembly line and located at the substrate supplier for true on-demand assembly and bond cure.

Focused Activation: By designing the electromagnetic field to activate only the area requiring bonding, other areas can be bonded later in the assembly process, allowing a phased assembly method.

Increased Production Control

Heats from within the bond line; eliminates distortion on outside substrate surfaces. Bonds can be achieved with minimal temperature rise of the surrounding substrates.

Field generated from only one side of the bond line; field probe is mounted on a flat teflon plate that can be used on one side of a pressure plate for assembling materials. In a dynamic web activation system, it is only necessary to place the field probe on one side of the web.

Controllable bond line temperatures allow for different functions to be achieved, such as drying, adhering, melting and fusing

Controllable open time: hot melt formulation can be maintained in the melt phase depending on the length of time the assembly is within the magnetic field. This may be useful in achieving material flow for improved mechanical bonding.

Inside the Step & Repeat Activation System, the field probe is mounted on a flat teflon plate.

Increased Productivity

Fast bonding rates of 2/10 of a second or less allow for line rates of 1500 ft./min. with a 1 meter long probe, or load-bond-load cycles of less than one second

Consumer Acceptance

Clear or light-colored for transparent bond lines with excellent cosmetic appearance