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Currently Available Bonding Formulations
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CODA 1
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Pre-applied heat generator for PP non-wovens |
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CODA 1 WD
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Pre-applied water dispersion for PP/PE non-wovens |
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CODA 4
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Pre-applied hot melt for paper/paperboard |
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CODA 5 WD
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Pre-applied water dispersion for paper/paperboard |
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The first step in our development process is the formulation and production of a bonding material for your specific application. CODACO's staff of chemists and engineers is ready to assist potential customers on an individual basis to determine the optimum material formulation and probe design. Depending on the process materials and parameters, the material can be formulated for reversible adhesive bonding or permanent fusion bonding. We welcome visitors to our Research & Development Facility in Rochester, New York.
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| Chemical formulation |
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The bonding material can be applied to the substrate as a conventional hot melt, aqueous spray, pattern print or film co-extrusion. Application can be accomplished on-line, or off-line for later on-demand activation. Since the material can be formulated to be tack-free after application, it can be re-rolled and/or stored for several months prior to activation. CODACO bonding material is compatible with most existing application equipment.
At the time of activation, the substrate with the previously applied bonding material is placed in an electromagnetic field created by the RF power supply and process/field probe. Activation can be static, or at line speeds up up 1500 feet per minute. Heat is generated within and throughout the bonding layer, causing the activation of the adhesive properties of the material. Bonding is quick (<200 milliseconds) and clean. Stress tests have shown that the strength of the bond is such that the substrate will fail before the bond. Selective bonding can be achieved through probe design and/or pattern imprinting of the adhesive.
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| Bonding material pre-coated onto PP |
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Paper sheets with pre-coated coated bonding material |
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